Megabond Solventless adhesive WY8079A/8079B is simple to process and handle, and allows fast curing at room temperature. The equipment is easy to clean and since the adhesive is solvent-free and 100% reactive, less energy is used during lamination application, curing and transportation than in conventional systems. These properties and features help to improve sustainability.
WY8079B adhesive with curing agent WY8079A is a two-component solvent-free polyurethane adhesive system for flexible packaging laminates.
It is designed for printed or unprinted, metalized and laminate structures consisting of PET, BOPP, PA used for printing or barrier films as well as foil lamination used for barrier films and linear low-density polythylene (LLDPE) and CPP films used for sealing during pouch manufacture. WY8079A/8079B provides high bond strength, capability of heat resistance to 121°/30minutes sterilization, and good wetting properties with a long pot life.
